High Melting Pb-Free Solder Alloys for Die-Attach Applications-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

High Melting Pb-Free Solder Alloys for Die-Attach Applications

Published:2005-10 Issue:10 Volume:7 Page:965-969
ISSN:1438-1656
Container-title:Advanced Engineering Materials
language:en
Short-container-title:Adv. Eng. Mater.

Author:

Rettenmayr M.,Lambracht P.,Kempf B.,Graff M.

Publisher

Wiley

Subject

Condensed Matter Physics,General Materials Science

Reference12 articles.

1. Commission of the European Community, Directive on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment, 2000.

2. Lead‐free alloys

Cited by 55 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Growth behavior and kinetics of interfacial IMC for ZnSnCuNiAl/Cu solder joints subjected to isothermal aging;Journal of Materials Science: Materials in Electronics;2024-09

2. Structural, thermal and mechanical properties of rapidly solidified Bi-0.5Ag lead-free solder reinforced Tb rare-earth element for high performance applications;Soldering & Surface Mount Technology;2024-02-09

3. Effect of Minor Sb Additions on Thermal Properties, Microstructure and Microhardness of Sn–Ag–Cu High-Temperature Solder Alloys;Physics of Metals and Metallography;2023-12-29

4. Improving the reliability of power modules through layered diffusion solder interconnects – Comparative study based on experiments and FE-simulation;Microelectronics Reliability;2023-11

5. Reliability of lead-free solders for die attach in automotive power modules;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP