Exploring Inorganic Flexible Electronics: III‐Nitride Light‐Emitting Diode Epilayers on Wafer‐Scale Exfoliable Mica Substrate

Author:

Lu Tongxin12,Liang Zhiwen23,Yuan Ye2ORCID,Liu Shangfeng12,Li Jiahui1,Zhao Jiale2,Cai Tianren2,Li Tai12,Luo Wei2,Wang Tao14,Wang Qi3,Wang Xinqiang123

Affiliation:

1. State Key Laboratory of Artificial Microstructure and Mesoscopic Physics School of Physics Nano‐Optoelectronics Frontier Center of Ministry of Education (NFC‐MOE) Peking University Beijing 100871 P. R. China

2. Songshan Lake Materials Laboratory Dongguan Guangdong 523808 P. R. China

3. Dongguan Institute of Opto‐Electronics Peking University Dongguan P. R. China

4. Electron Microscopy Laboratory School of Physics Peking University Beijing 100871 P. R. China

Abstract

AbstractMica is a promising substrate for flexible photonic applications because it can be fabricated using wafer‐scale multiple exfoliations. However, the large lattice mismatch between mica and III‐nitrides hinders their application in III‐nitride semiconductor devices. In this study, two types of light‐emitting diode (LED) epilayers, blue and green, are epitaxially fabricated on 2‐inch exfoliated mica substrates using sputtered AlN as a buffer layer to address the lattice mismatch. The LED epilayers on mica substrate exhibit excellent single‐crystalline quality with a low threading dislocation density of 2.07 × 109 cm−2 in the GaN region and smooth surface morphology with a root mean square (RMS) roughness of 0.58 nm in a 5 × 5 µm2 scanned area, demonstrating that mica is an excellent platform for III‐nitride semiconductors. Moreover, the structures are reproduced stably on multiple exfoliated mica at the wafer scale, which verified the reusability and reproducibility of III‐nitride/mica in terms of crystallinity, surface morphology, and transparency. Strong electroluminescence of the LED epilayers confirmed the potential of mica in electrically driven flexible opto‐electronics. Therefore, this results demonstrated the potential of mica substrates in III‐nitride semiconductors and provide a novel pathway for revolutionizing the fabrication of III‐nitride‐based flexible devices.

Funder

National Key Research and Development Program of China

National Natural Science Foundation of China

Publisher

Wiley

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