Advances in Embedded and Fan‐Out Wafer‐Level Packaging Technologies
Author:
Publisher
Wiley
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/9781119313991
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Development of Packaging and Testing Industry;Handbook of Integrated Circuit Industry;2023-11-28
2. A process method for making BGA solder mask using nickel oxide;2023 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM);2023-07-15
3. High-Resolution Printing of Redistribution Layers for Fan-Out Wafer-Level Packaging by using Ultra-Precise Micro-deposition Technology;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13
4. Challenges for High Volume Testing of Embedded IO Interfaces in Disaggregated Microprocessor Products;2022 IEEE International Test Conference (ITC);2022-09
5. Study of metalization on polyimide-coated quartz glass for spatial application;2022 International Conference on Microwave and Millimeter Wave Technology (ICMMT);2022-08-12
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