Development of silicon wafer packaging technology for deep UV LED
Author:
Affiliation:
1. Stanley Electric CO., LTD Yokohama Kanagawa Japan
2. Tanaka Lab, Graduate School of Engineering Tohoku University Sendai Miyagi Japan
Publisher
Wiley
Subject
Electrical and Electronic Engineering,Energy Engineering and Power Technology
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/eej.23298
Reference18 articles.
1. Ultraviolet light-emitting diodes based on group three nitrides
2. Advances in group III-nitride-based deep UV light-emitting diode technology
3. Design and Fabrication of Two-Dimensional Photonic Crystals with Predetermined Nonlinear Optical Properties
4. Light extraction enhancement of 265 nm deep-ultraviolet light-emitting diodes with over 90 mW output power via an AlN hybrid nanostructure
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