Magnetic‐Force‐Induced‐Luminescent Effect in Flexible ZnS:Cu/PDMS/NdFeB Composite

Author:

PourhosseiniAsl MohammadJavad1ORCID,Berbille Andy23,Wang Shuyang23,Yu Zhonghui1,Li Zhanmiao1,Ren Kailiang23ORCID,Dong Shuxiang14ORCID

Affiliation:

1. Department of Materials Science and Engineering College of Engineering Peking University Beijing 100871 China

2. CAS Center for Excellence in Nanoscience Beijing Key Laboratory of Micro‐Nano Energy and Sensor Beijing Institute of Nanoenergy and Nanosystems Chinese Academy of Sciences Beijing 101400 P. R. China

3. School of Nanoscience and Technology University of Chinese Academy of Sciences Beijing 100049 China

4. Institute for Advanced Study Shenzhen University Shenzhen 518061 China

Abstract

AbstractThe force‐induced light‐emitting phenomenon in polymer composites plays an important role in the soft electronic field due to its display function. Here, a magnetic‐force‐induced‐luminescence (MFIL) effect is reported in ZnS:Cu particle‐doped polydimethylsiloxane incorporated with a NdFeB magnetic tip mass for real‐time incident magnetic field strength light‐emitting display. Investigations show that the luminescence intensity increases nearly linear in response to the applied AC magnetic field, HAC; meanwhile, the minimum HAC for inducing MFIL is as low as 0.1 mT (1 Oe) at the resonance. The MFIL effect is 1000 times better and more energy‐efficient than the best result published previously. The findings, thus, indicate that the MFIL effect could serve as an effective method for light‐emitting display triggered by HAC; MFIL essentially originates from the donor–acceptor recombination between shallow donor level and the t2 level of Cu2 in ZnS:Cu semiconductor particles. The present results could, thus, provide a viable pathway toward multifunctional flexible electronic designs and applications, especially toward those for the real‐time visualization of remote magnetic field sensing.

Funder

National Natural Science Foundation of China

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials

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