Electron beam-melted, free-form-fabricated titanium alloy implants: Material surface characterization and early bone response in rabbits
Author:
Publisher
Wiley
Subject
Biomedical Engineering,Biomaterials
Reference35 articles.
1. Osseointegration in skeletal reconstruction and rehabilitation: a review;Brånemark;J Rehabil Res Dev,2001
2. Clinical experiences with dental implants;Henry;Adv Dent Res,1999
3. A retrospective 5-year follow-up study of two different titanium implant surfaces used after interpositional bone grafting for reconstruction of the atrophic edentulous maxilla;Hallman;Clin Implant Dent Relat Res,2005
4. Failed dental implants-Clinical, radiological and bacteriological findings in 17 patients;Laine;J Craniomaxillofac Surg,2005
5. Reconstruction of the severely resorbed maxilla with autogenous bone, platelet-rich plasma, and implants: 1-year results of a controlled prospective 5-year study;Thor;Clin Implant Dent Relat Res,2005
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