The Effects of Amide Groups on the Thermal and Optical Properties of Poly(amide-imide)s with Low Residual Stress for Microelectronic Devices-Reference-Cited by-同舟云学术

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The Effects of Amide Groups on the Thermal and Optical Properties of Poly(amide-imide)s with Low Residual Stress for Microelectronic Devices

Published:2016-02-29 Issue:10 Volume:217 Page:1174-1184
ISSN:1022-1352
Container-title:Macromolecular Chemistry and Physics
language:en
Short-container-title:Macromol. Chem. Phys.

Author:

Kim Kwangin¹,Yoo Taewon¹,Ha Hyemin¹,Kim Jinyoung¹,Han Patrick²,Han Haksoo¹

Affiliation:

1. Department of Chemical and Biomolecular Engineering; Yonsei University; 262 Seongsanno Seodaemun-gu Seoul 120-749 South Korea

2. Department of Chemical and Environmental Engineering; Yale University; 55 Prospect Street New Haven CT 06511 USA

Funder

Korean Government

Human Resources Program in Energy Technology of the Korea Institute of Energy Technology Evaluation and Planning

Ministry of Trade, Industry & Energy, Republic of Korea

Publisher

Wiley

Subject

Materials Chemistry,Organic Chemistry,Polymers and Plastics,Physical and Theoretical Chemistry,Condensed Matter Physics

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/macp.201500495/fullpdf

Reference26 articles.

1. Thermally stable polyimides from solutions of monomeric reactants

2. Effect of polyimides with different ratios of para - to meta - analogous fluorinated diamines on relaxation process

3. Synthesis and properties of poly(imide-hydrazide)s and poly(amide-imide-hydrazide)s fromN-[p-(orm-)carboxyphenyl]trimellitimide and aromatic dihydrazides orp-aminobenzhydrazide via the phosphorylation reaction

4. Stress behaviors and thermal properties of polyimide thin films depending on the different curing process

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1. A study of the residual stress behavior of rigid and flexible epoxy adhesives during thermal cycle aging for electronics packaging;Journal of Adhesion Science and Technology;2023-08-13

2. Colorless poly(amide‐imide) copolymers for flexible display applications;Journal of Applied Polymer Science;2022-08-26

3. Adhesion and Interface Studies of the Structure‐Controlled Polyimide with Smooth Copper for High‐Frequency Communication;Advanced Materials Interfaces;2022-01-05

4. Residual stress and thermal properties of rubber‐modified epoxy systems for semiconductor package;Journal of Applied Polymer Science;2021-10-19

5. Thermally stable, solution processable and redox active new poly(amide-imide)s: synthesis and characterization;Chemical Papers;2021-01-22

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