Compliant composite elastomers via grafting short dangling chains for promoting thermal transport performance

Abstract

AbstractThe multifunctional composite elastomers serve as thermal interface materials for heat dissipation in electronic devices when their thermal transport performance is enhanced. The common method for enhancement, continuously raising the thermal conductive filler loading only can improve thermal conductivity of composite elastomers but reduces compliance, resulting in elevated contact thermal resistance with solid surfaces, compromising thermal transport. To address this, we propose grafting short dangling chains onto the composite elastomer matrix to further promote compliance under a certain filler loading. Characterization results demonstrate that the grafted chains effectively reduce relaxation time, enabling faster deformation for the material under pressure. This approach enhances interfacial compatibility, widening the thermal transport path at contact interfaces to contact thermal resistance by 94% (from 17.8 to 1.07 mm2W/K), significantly improving overall thermal transport. Additionally, we discussed the feasibility of employing composite elastomers as thermal interface materials for efficient chip heat dissipation.Highlight The grafted dangling chains can promote the composite elastomers softness. The softness promotion can help reduce thermal contact resistance. A series of theories are employed to learn the mechanisms of the promotion. The resulting composite elastomers can be used as thermal interface materials.