Bonding Behavior and Mechanism of Composite Interface Between Carbon Steel/Stainless Steel Laminates at Different Temperatures and Strain Rates

Author:

Hu Xiaoke1,Song Hechuan12ORCID,Yang Kai3,Zhou Xiaomin12,Zhang Qingdong12,Zhang Boyang12

Affiliation:

1. School of Mechanical Engineering University of Science and Technology Beijing Beijing 100083 China

2. Shunde Innovation School University of Science and Technology Beijing Foshan 528399 China

3. Mechanical Product Division Beijing Spacecraft Beijing 100094 China

Abstract

Compared to hot roll and explosive bonding, there are relatively few studies on warm/cold roll bonding under low temperature conditions. In this article, the warm/cold roll bonding simulation experiment is conducted to research the deformation, interface bonding rate, microstructure, element diffusion behavior, metallographic structure, and phase of carbon steel/stainless steel. The results show that the plastic deformation remains consistent below 400 °C but exhibits temperature sensitivity above 400 °C. The lower strain rate can increase the bonding rate, while insulation treatment may reduce the bonding rate. The formation of cracks is inhibited at 25 °C and 45% reduction rate due to the challenge of cracking the surface oxide film. Temperature significantly affects bonding, with improved performance observed above 600 °C. Uneven element distribution of bonding area may be related to the precipitated compounds, while insulation treatment increases the mutual diffusion ability of elements. The increase in temperature leads to an increase in pearlite, a decrease in ferrite, and decarburization occurs within the carbon steel matrix. The carbon elements diffuse from carbon steel to the surface of stainless steel. The increase in temperature increases the content of surface compounds.

Funder

Natural Science Foundation of Beijing Municipality

Fundamental Research Funds for the Central Universities

Anhui Provincial Key Research and Development Plan

Publisher

Wiley

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3