Interface Wetting and Reaction Behavior between Mold Flux and Submerged Entry Nozzle under an External Electric Field

Author:

Tian Chen12ORCID,Yuan Lei23,Peng Zijun2,Liu Xiaoming1,Wang Qiang1

Affiliation:

1. Key Laboratory of Electromagnetic Processing of Materials (Ministry of Education) Northeastern University Shenyang 110819 P. R. China

2. School of Metallurgy Northeastern University Shenyang 110819 P. R. China

3. Institute for Frontier Technologies of Low-Carbon Steelmaking Northeastern University Shenyang 110819 P. R. China

Abstract

Herein, to provide theoretical foundation and experimental data for using electric field to control the service performance and improve the service life of submerged entry nozzle, the effect of the external electric field on the interfacial reaction and wetting behavior between the mold flux and the slag‐line materials is studied. The results show that the wettability of mold flux on the surface of the slag‐line materials is mainly affected by the dissolution and spreading under normal conditions. However, the electrochemical reaction and electric force generated by the applied electric field are also important factors for driving and changing the wettability between the mold flux and slag‐line materials. Under the positive electric field, the total duration of complete spreading and wetting is 227 s, which is 13 s shorter than that under normal conditions; the contact angle after complete wetting is about 17°, which is 1.5° lower than that under normal conditions. Under the negative electric field, the total duration of complete spreading and wetting is 260 s, which is 20 s longer than that under normal conditions; the contact angle after complete wetting is about 21°, which is 2.5° higher than that under normal conditions.

Funder

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

Publisher

Wiley

Subject

Materials Chemistry,Metals and Alloys,Physical and Theoretical Chemistry,Condensed Matter Physics

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