High‐resolution simulation of a severe case of low‐level windshear at the Hong Kong International Airport: Turbulence intensity and sensitivity to turbulence parameterization scheme
Author:
Affiliation:
1. Hong Kong Observatory Kowloon Hong Kong China
2. City University of Hong Kong, Tat Chee Avenue Kowloon Hong Kong China
Publisher
Wiley
Subject
Atmospheric Science
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/asl.1090
Reference13 articles.
1. Atmospheric turbulence in complex terrain: Verifying numerical model results with observations by remote-sensing instruments
2. LIDAR-based turbulence intensity calculation using glide-path scans of the Doppler LIght Detection And Ranging (LIDAR) systems at the Hong Kong International Airport and comparison with flight data and a turbulence alerting system
3. Performance of super high resolution numerical weather prediction model in forecasting terrain‐disrupted airflow at the Hong Kong International Airport: case studies
4. High‐resolution (40 m) simulation of a severe case of low‐level windshear at the Hong Kong International Airport—Comparison with observations and skills in windshear alerting
5. Stratocumulus-capped mixed layers derived from a three-dimensional model
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Performance of large-eddy simulations for capturing low-level wind shear at the Hong Kong International Airport for a whole wind-shear (spring) season;Meteorologische Zeitschrift;2023-10-16
2. Performance of windshear/microburst detection algorithms using numerical weather prediction model data for selected tropical cyclone cases;Atmospheric Science Letters;2023-05-02
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3