An empirically derived model for further increasing microwave curing rates of epoxy‐amine polymerizations

Author:

Hubbard Robert L.1,Tyler David R.2ORCID,Thompson Brady2

Affiliation:

1. Lambda Technologies, Inc. Morrisville North Carolina USA

2. Department of Chemistry and Biochemistry University of Oregon Eugene Oregon USA

Funder

Oregon Nanoscience and Microtechnologies Institute

National Science Foundation

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Reference16 articles.

1. https://www.mordorintelligence.com/industry-reports/epoxy-adhesives-market accessed on January 20 2020.

2. Structure and ultimate properties of epoxy resins

3. Li L. Xue J. Ahmad M. Brillhart M. Ding M. Lu G. Ho P.inProc. IEEE Electronic Components and Technology Conf. May 30 2006 San Diego CA.

4. Paquet M. Gaynes M. Doschesne E. Questad D. Belanger L. Sylvestre J.inProc. IEEE Electronic Components and Technology Conf. May 30 2006 San Diego CA.

5. Chemistry and Technology;Lewis A.,1988

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