Integrated the inductors on ultra-thin Si substrate to improve the RF performance for low-noise amplifier applications-Reference-Cited by-同舟云学术

Integrated the inductors on ultra-thin Si substrate to improve the RF performance for low-noise amplifier applications

Published:2010-07 Issue:7 Volume:52 Page:1576-1579
ISSN:0895-2477
Container-title:Microwave and Optical Technology Letters
language:en
Short-container-title:Microw. Opt. Technol. Lett.

Author:

Kao H. L.,Chang T.

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. R. Dekker K. Dessein J.-H. Fock A. Gakis C. Jonville O. M. Kuijken T. M. Michielsen P. Mijlemans H. Pohlmann W. Schnitt C. E. Timmering A. M. H. Tombeur Substrate transfer: Enabling technology for RF applications Washington, DC, 2003 371 374

2. T. Takayama Y. Ohno Y. Goto A. Machida M. Fujita J. Maruyama K. Kato J. Koyama S. Yamazaki A CPU on a plastic film substrate 2004 230 231

3. Substrate transfer for RF technologies;Dekker;IEEE Trans Electron Device,2003

4. High-performance inductors on plastic substrate;Guo;IEEE Electron Device Lett,2005

5. K. Kuhn R. Basco D. Becher M. Hattendorf P. Packan I. Post P. Vandervoorn I. Young A comparison of state-of-the-art NMOS and SiGe HBT devices for analog/mixed-signal/RF circuit applications 2004 224 225

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