Nanoneedles based on porous silicon for chip bonding with self assembly capability-Reference-Cited by-同舟云学术

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Nanoneedles based on porous silicon for chip bonding with self assembly capability

Published:2011-04-07 Issue:6 Volume:8 Page:1841-1846
ISSN:1862-6351
Container-title:physica status solidi (c)
language:en
Short-container-title:Phys. Status Solidi C

Author:

Jonnalagadda Prasad,Mescheder Ulrich,Kovacs Andras,Nimoe Antwi

Publisher

Wiley

Subject

Condensed Matter Physics

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Exploring the Influence of Solvents on Electrochemically Etched Porous Silicon Based on Photoluminescence and Surface Morphology Analysis;Materials;2024-02-21

2. Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration;Journal of Electronic Packaging;2021-11-22

3. Formation Mechanisms of Self-Organized Needles in Porous Silicon Based Needle-Like Surfaces;Journal of The Electrochemical Society;2018

4. Nonlinear Mechanics of Interlocking Cantilevers;Journal of Applied Mechanics;2017-10-27

5. Effect of Capillary Forces in Room Temperature Si-Si Direct Bonding Technique Using Velcrolike Surfaces;Journal of Microelectromechanical Systems;2017-04

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