Influence of the cure state on mechanical properties of an epoxy‐based adhesive: Experimental characterization and numerical simulation
Author:
Affiliation:
1. Institute of Science and Innovation in Mechanical and Industrial Engineering (INEGI) Porto Portugal
2. Departamento de Engenharia Mecânica, Faculdade de Engenharia Universidade do Porto Porto Portugal
Publisher
Wiley
Subject
Polymers and Plastics
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/pat.5589
Reference27 articles.
1. Determination of cure-dependent properties of adhesives by thermal analysis using reaction kinetics and a novel experimental apparatus
2. Methodology for optimization of the curing cycle of paste adhesives
3. Shrinkage in relation to the TTT-Features of an epoxy adhesive
4. Cure kinetics and viscosity modelling of a high-performance epoxy resin film
5. Experimental methods to capture curing induced effects in adhesive bonded joints
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1. Modeling the cure shrinkage–induced warpage of epoxy molding compound;International Journal of Mechanical Sciences;2024-04
2. How to predict residual stresses of curing adhesives ab initio solely using extended rheometry;The Journal of Adhesion;2023-02-26
3. Thermal Properties of Polymer Floor Coating with Alternative Granite Powder Filler;Testing and Experimentation in Civil Engineering;2023
4. Comparison of Different Cure Monitoring Techniques;Sensors;2022-09-26
5. Cure-induced stress build-up in adhesives: model building and parameter studies;The Journal of Adhesion;2022-09-06
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