Electrical Conductive Adhesives Enhanced with High-Aspect-Ratio Silver Nanobelts-Reference-Cited by-同舟云学术

Electrical Conductive Adhesives Enhanced with High-Aspect-Ratio Silver Nanobelts

Author:

Amoli Behnam Meschi¹²,Marzbanrad Ehsan³⁴,Hu Anming³⁴,Zhou Y. Norman³²⁴,Zhao Boxin¹²

Affiliation:

1. Department of Chemical Engineering; University of Waterloo; 200 University Avenue West Waterloo ON N2L 3G1 Canada

2. Waterloo Institute for Nanotechnology; University of Waterloo; 200 University Avenue West, Waterloo ON N2L 3G1 Canada

3. Department of Mechanical and Mechatronics Engineering; University of Waterloo; 200 University Avenue West Waterloo ON N2L 3G1 Canada

4. Centre for Advanced Materials Joining; University of Waterloo; 200 University Avenue West, Waterloo ON N2L 3G1 Canada

Funder

Natural Sciences and Engineering Research Council of Canada (NSERC).

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Organic Chemistry,General Chemical Engineering

Link

Reference40 articles.

3. R. Zhang J. C. Agar C. P. Wong 12th Electron. Packag. Tech. Conf 2010

4. S. Bohm E. Stammen G. Hemken M. Wanger Microjoining and Nanojoining 1 Y. CRC Press Boca Raton, Florida, USA 2008

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