1. The use of dielectric analysis to study the cure of a filled epoxy resin;Martin;Mater Eval,1976
2. Ion graphing as an in-process cure monitoring procedure for composite and adhesively bonded structures;Crabtree,1977
3. Acoustic emission as an aid for investigating composite manufacturing processes;Houghton,1979
4. Thermoset cure process control for utilizing micro dielectric feedback;Day,1988
5. Dynamic dielectric analysis: monitoring the chemistry and rheology during cure of thermosets;Kranbuehl;ACS Div Polym Mater Sci Eng,1987