Thermal analysis of multi-finger GaInP collector-up heterojunction bipolar transistors with miniature heat-dissipation packaging structures

Author:

Lee Pei-Hsuan,Tseng Hsien-Cheng,Chou Jung-Hua

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Computer Science Applications,Modelling and Simulation

Reference8 articles.

1. High linearity power X-band GaInP/GaAs hetero-junction bipolar transistor;Liu;IEEE Electron Device Letters,1994

2. Application of GaInP/GaAs DHBT's to power amplifiers for wireless communications;Chen;IEEE Transactions on Microwave Theory and Techniques,1999

3. Thermal design studies of high-power heterojunction bipolar transistors;Gao;IEEE Transactions on Electron Devices,1989

4. Heterostructure bipolar transistors and integrated circuits;Kroemer;Proceedings of the IEEE,1982

5. SiGe HBTs with normal high-speed emitter-up and reverse low-power collector-up operation;Choi;IEEE Transactions on Electron Devices,2008

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