Low‐temperature chemical vapor deposition growth of 2D materials

Author:

Lei Minting1,Wang Peijian1ORCID,Ke Xiaofeng1,Xie Jun1,Yue Min1,Zhao Mei1,Zhang Kenan2,Dong Youqing1,Xu Quanlong1,Zou Chao1,Wang Shun12,Zhang Lijie12

Affiliation:

1. Key Laboratory of Carbon Materials of Zhejiang Province College of Chemistry and Materials Engineering Wenzhou University Wenzhou China

2. Zhejiang Engineering Research Center for Electrochemical Energy Materials and Devices Institute of New Materials & Industry Technology Wenzhou University Wenzhou China

Abstract

AbstractTwo‐dimensional (2D) materials have atomic thickness, and thickness‐dependent electronic transport, optical and thermal properties, highlighting great promise applications in future semiconductor devices. Chemical vapor deposition (CVD) is considered as an industry‐oriented method for macro‐synthesis of 2D materials. In conventional CVD, high temperatures are required for the synthesis of high‐quality large‐size 2D materials, which is incompatible with of back‐end‐of‐line of the complementary metal oxide semiconductor (CMOS) techniques. Therefore, low‐temperature synthesis of 2D materials is of critical importance for the advancement toward practical applications of 2D materials with the CMOS technologies. In this review, we focus on strategies for the low‐temperature growth of 2D materials, including the use of low‐melting‐point precursors, metal‐organic CVD, plasma‐enhanced CVD, van der Waals‐substrate vapor phase epitaxy, tellurium‐assisted CVD, salt‐assisted CVD, etc., with discussions of their reaction mechanisms, applications, associated advantages, and limitations. We also provide an outlook and perspectives of future low‐temperature chemical vapor deposition growth of 2D materials.

Funder

National Natural Science Foundation of China

Publisher

Wiley

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