Cu Intercalation and Br Doping to Thermoelectric SnSe 2 Lead to Ultrahigh Electron Mobility and Temperature‐Independent Power Factor-Reference-Cited by-同舟云学术

Cu Intercalation and Br Doping to Thermoelectric SnSe 2 Lead to Ultrahigh Electron Mobility and Temperature‐Independent Power Factor

Published:2019-12 Issue:6 Volume:30 Page:1908405
ISSN:1616-301X
Container-title:Advanced Functional Materials
language:en
Short-container-title:Adv. Funct. Mater.

Author:

Zhou Chongjian¹²^ORCID,Yu Yuan³^ORCID,Zhang Xiangzhao⁴,Cheng Yudong³,Xu Jingtao⁵,Lee Yong Kyu¹²,Yoo Byeongjun¹²,Cojocaru‐Mirédin Oana³^ORCID,Liu Guiwu⁴,Cho Sung‐Pyo⁶,Wuttig Matthias³⁷^ORCID,Hyeon Taeghwan¹²^ORCID,Chung In¹²^ORCID

Affiliation:

1. Center for Nanoparticle ResearchInstitute for Basic Science (IBS) Seoul 08826 Republic of Korea

2. School of Chemical and Biological Engineering and Institute of Chemical ProcessesSeoul National University Seoul 08826 Republic of Korea

3. I. Physikalisches Institut (IA)RWTH Aachen University Sommerfeldstraße 52074 Aachen Germany

4. School of Materials Science and EngineeringJiangsu University Zhenjiang 212013 China

5. Ningbo Ruiling Institute for Energy and Environment Solutions Ningbo 315500 China

6. National Center for Inter‐University Research FacilitiesSeoul National University Seoul 08826 Republic of Korea

7. JARA‐Institut Green‐ITJARA‐FITForschungszentrum Jülich GmbH and RWTH Aachen University 52056 Aachen Germany

Funder

Institute for Basic Science

National Research Foundation of Korea

Ministry of Science, ICT and Future Planning

Publisher

Wiley

Subject

Electrochemistry,Condensed Matter Physics,Biomaterials,Electronic, Optical and Magnetic Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adfm.201908405

Reference73 articles.

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3. Excessively Doped PbTe with Ge-Induced Nanostructures Enables High-Efficiency Thermoelectric Modules

4. Power generation from nanostructured PbTe-based thermoelectrics: comprehensive development from materials to modules

5. High-Power-Density Skutterudite-Based Thermoelectric Modules with Ultralow Contact Resistivity Using Fe–Ni Metallization Layers

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