Block Copolymer Packing Limits and Interfacial Reconfigurability in the Assembly of Periodic Mesoporous Organosilicas-Reference-Cited by-同舟云学术

Block Copolymer Packing Limits and Interfacial Reconfigurability in the Assembly of Periodic Mesoporous Organosilicas

Author:

Wills Andrew W.¹,Michalak David J.²,Ercius Peter¹³,Rosenberg Ethan R.¹,Perciano Talita⁴,Ushizima Daniela⁴,Runser Rory¹,Helms Brett A.¹

Affiliation:

1. The Molecular Foundry; Lawrence Berkeley National Laboratory; Berkeley CA 94720 USA

2. Intel Corporation; Hillsboro OR 97124 USA

3. The National Center for Electron Microscopy; The Molecular Foundry; Lawrence Berkeley National Laboratory; Berkeley CA 94720 USA

4. Computational Research Division; Lawrence Berkeley National Laboratory; Berkeley CA 94720 USA

Publisher

Wiley

Subject

Electrochemistry,Condensed Matter Physics,Biomaterials,Electronic, Optical and Magnetic Materials

Reference69 articles.

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献