Soft Core/Shell Packages for Stretchable Electronics-Reference-Cited by-同舟云学术

Soft Core/Shell Packages for Stretchable Electronics

Published:2015-05-15 Issue:24 Volume:25 Page:3698-3704
ISSN:1616-301X
Container-title:Advanced Functional Materials
language:en
Short-container-title:Adv. Funct. Mater.

Author:

Lee Chi Hwan¹,Ma Yinji²³,Jang Kyung-In¹,Banks Anthony¹,Pan Taisong²⁴,Feng Xue³,Kim Jae Soon⁵,Kang Daeshik¹,Raj Milan S.⁶,McGrane Bryan L.⁶,Morey Briana⁶,Wang Xianyan⁶,Ghaffari Roozbeh⁶,Huang Yonggang⁷,Rogers John A.⁸

Affiliation:

1. Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory; University of Illinois at Urbana-Champaign; Urbana IL 61801 USA

2. Department of Civil and Environmental Engineering and Mechanical Engineer; Center for Engineering and Health and Skin Disease Research Center; Northwestern University; Evanston IL 60208 USA

3. Department of Engineering Mechanics; Center for Mechanics and Materials; Tsinghua University; Beijing 100084 China

4. State Key Laboratory of Electronic Thin Films and Integrated Devices; University of Electronic Science and Technology of China; Chengdu Sichuan 610054 China

5. Department of Chemistry; University of Illinois at Urbana-Champaign; Urbana IL 61801 USA

6. MC10, Inc.; Cambridge MA 02140 USA

7. Department of Civil and Environmental Engineering and Mechanical Engineering; Northwestern University; Evanston IL 60208 USA

8. Department of Materials Science and Engineering; Chemistry, Mechanical Science and Engineering; Electrical and Computer Engineering; Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials; Research Laboratory; University of Illinois at Urbana-Champaign; Urbana IL 61801 USA

Publisher

Wiley

Subject

Electrochemistry,Condensed Matter Physics,Biomaterials,Electronic, Optical and Magnetic Materials

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/adfm.201501086/fullpdf

Reference12 articles.

1. Soft Microfluidic Assemblies of Sensors, Circuits, and Radios for the Skin

2. Epidermal Electronics

3. Capacitive Epidermal Electronics for Electrically Safe, Long‐Term Electrophysiological Measurements

4. Ultrathin conformal devices for precise and continuous thermal characterization of human skin

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