Functional Soft Composites As Thermal Protecting Substrates for Wearable Electronics-Reference-Cited by-同舟云学术

Functional Soft Composites As Thermal Protecting Substrates for Wearable Electronics

Published:2019-08-30 Issue:45 Volume:29 Page:1905470
ISSN:1616-301X
Container-title:Advanced Functional Materials
language:en
Short-container-title:Adv. Funct. Mater.

Author:

Shi Yingli¹^ORCID,Wang Chengjun²,Yin Yafei¹,Li Yuhang¹³,Xing Yufeng¹,Song Jizhou²^ORCID

Affiliation:

1. Institute of Solid MechanicsBeihang University (BUAA) Beijing 100191 China

2. Department of Engineering MechanicsSoft Matter Research Centerand Key Laboratory of Soft Machines and Smart Devices of Zhejiang ProvinceZhejiang University Hangzhou 310027 China

3. Aircraft and Propulsion LaboratoryNingbo Institute of TechnologyBeihang University (BUAA) Ningbo 315100 China

Funder

National Basic Research Program of China

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

Publisher

Wiley

Subject

Electrochemistry,Condensed Matter Physics,Biomaterials,Electronic, Optical and Magnetic Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adfm.201905470

Reference45 articles.

1. Nanomesh on-skin electronics

2. Mechanics of stretchable electronics

3. Mechanics of stretchable batteries and supercapacitors

4. Mechanics and thermal management of stretchable inorganic electronics

5. The equivalent medium of cellular substrate under large stretching, with applications to stretchable electronics

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