Flexible Thermoelectric Devices of Ultrahigh Power Factor by Scalable Printing and Interface Engineering-Reference-Cited by-同舟云学术

Flexible Thermoelectric Devices of Ultrahigh Power Factor by Scalable Printing and Interface Engineering

Published:2019-11-14 Issue:5 Volume:30 Page:1905796
ISSN:1616-301X
Container-title:Advanced Functional Materials
language:en
Short-container-title:Adv. Funct. Mater.

Author:

Varghese Tony¹,Dun Chaochao²,Kempf Nicholas²,Saeidi‐Javash Mortaza²,Karthik Chinnathambi¹,Richardson Joseph³,Hollar Courtney⁴,Estrada David¹,Zhang Yanliang²^ORCID

Affiliation:

1. Micron School of Materials Science and Engineering Boise State University Boise ID 83725 USA

2. Department of Aerospace and Mechanical Engineering University of Notre Dame Notre Dame IN 46556 USA

3. Department of Electrical and Computer Engineering Boise State University Boise ID 83725 USA

4. Department of Mechanical and Biomedical Engineering Boise State University Boise ID 83725 USA

Funder

National Science Foundation

Defense Advanced Research Projects Agency

U.S. Department of Energy

National Aeronautics and Space Administration

Publisher

Wiley

Subject

Electrochemistry,Condensed Matter Physics,Biomaterials,Electronic, Optical and Magnetic Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adfm.201905796

Reference47 articles.

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3. Ultralow thermal conductivity and high thermoelectric figure of merit in SnSe crystals

4. Bulk nanostructured thermoelectric materials: current research and future prospects

5. A new class of doped nanobulk high-figure-of-merit thermoelectrics by scalable bottom-up assembly

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