Implantable Wet‐Adhesive Flexible Electronics with Ultrathin Gelatin Film

Author:

Yuan Ximin12,Kong Weicheng3,Xia Pengcheng4,Wang Zhenjia12,Gao Qing3,Xu Jie12,Shan Debin12,Yao Qingqiang4,Ma Zhiyong5,Guo Bin12,He Yong36ORCID

Affiliation:

1. State Key Laboratory of Advanced Welding and Joining Harbin Institute of Technology Harbin 150001 China

2. National Innovation Center for Advanced Medical Devices Shenzhen 457001 China

3. State Key Laboratory of Fluid Power and Mechatronic Systems School of Mechanical Engineering Zhejiang University Hangzhou 310027 China

4. Department of Orthopaedic Surgery Institute of Digital Medicine Nanjing First Hospital Nanjing Medical University Nanjing 210006 China

5. School of Engineering Huzhou University Huzhou Zhejiang 313000 China

6. Key Laboratory of 3D Printing Process and Equipment of Zhejiang Province College of Mechanical Engineering Zhejiang University Hangzhou 310027 China

Abstract

AbstractImplantable flexible electronic has attracted significant research interest in various fields. However, it still faces the challenge of simultaneously achieving tight adhesion to tissues in a mildly wet environment and possessing excellent biocompatibility to reduce immune rejection reactions after implantation. Here, a degradable wet‐adhesive flexible electronic device based on liquid metal and ultrathin gelatin film is developed. The ultrathin gelatin film forms numerous hydrogen bonds with tissue in a slightly humid environment, rapidly constructing a wet‐adhesive interface without damaging tissue structure. Inkjet printing is utilized to pattern the mixture of liquid metal and PVP on the surface of the ultrathin gelatin to create flexible patch. With the excellent conductivity of liquid metal, low toxicity, and similarity to natural tissue components of gelatin, flexible patch exhibits outstanding biocompatibility and fatigue resistance. It can be implanted in the body for up to 6 weeks, retaining monitoring capabilities and resisting 1 000 000 cycles of bending fatigue. This study provides a novel strategy for the future development of implantable flexible electronics.

Funder

National Key Research and Development Program of China

National Natural Science Foundation of China

Publisher

Wiley

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