Author:
Scamporrino Emilio,Mineo Placido,Scamporrino Andrea,Dattilo Sandro,Vitalini Daniele,Alicata Rossana
Funder
Ministero Istruzione Università e Ricerca (MIUR, Roma) and the National Research Council
Subject
Materials Chemistry,Organic Chemistry,Polymers and Plastics
Reference9 articles.
1. Advances in Microelectronics—From Microscale to Nanoscale Devices
2. Wang , M. X. Suzuki , K. Dai , W. W.-M. Low , Y. L. O'Conner , W. J. Tai , K. L. Integration of Large-Scale FPGA and DRAM in a Package Using Chip-on-Chip Techonology, Asia and South Pacific Design Automation Conference 2000 205 210
3. Wang , M. Suzuki , K. Sakai , A. Dai , W. Memory and Logic Integration for System-in-a-Package in Asic, 2001 Proceedings 2001 843 847
4. Recent advances in plastic packaging of flip-chip and multichip modules (MCM) of microelectronics
5. Crane , L. N. Konarski , M. M. Kneafsey , B. J. Torres-Filho , A. Szxzepaniak , Z. A. 2006
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