27.4: The Crevice Corrosion of Copper in TFT‐LCD Fabrication-Reference-Cited by-同舟云学术

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27.4: The Crevice Corrosion of Copper in TFT‐LCD Fabrication

Published:2019-09 Issue:S1 Volume:50 Page:287-289
ISSN:0097-966X
Container-title:SID Symposium Digest of Technical Papers
language:en
Short-container-title:SID Symposium Digest of Technical Papers

Author:

Chen Meng¹,Li Guo¹,Sun Yao¹,Liu Huangzheng¹,Liu Jing¹,Xia Hui¹,Tan Zhiwei¹,Chiou Chung-yi¹

Affiliation:

1. Shenzhen China Star Optoelectronics Technology Co., Ltd Guangdong China

Publisher

Wiley

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/sdtp.13469

Reference4 articles.

1. Diffusion barrier properties of TiW between Si and Cu

2. 3.07 – Corrosion of Copper and its Alloys[J];C D S Tuck;Shreirs Corrosion

3. Comparison of corrosion-resistance and hydrogen permeation properties of Zn–Ni, Zn–Ni–Cd and Cd coatings on low-carbon steel

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. P‐82: Analysis and Validation of TFT‐LCD Data Open Mechanism;SID Symposium Digest of Technical Papers;2024-06

2. P‐47: Influences of Mo Film Residual Stress on Cu/Mo Interface and Undercut Performance;SID Symposium Digest of Technical Papers;2020-08

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