High‐aspect‐ratio oxide etching using CF <sub>4</sub> /C <sub>6</sub> F <sub>12</sub> O plasma in an inductively coupled plasma etching system with low‐frequency bias power-Reference-Cited by-同舟云学术

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High‐aspect‐ratio oxide etching using CF ₄ /C ₆ F ₁₂ O plasma in an inductively coupled plasma etching system with low‐frequency bias power

Published:2022-11-23 Issue:3 Volume:20 Page:2200167
ISSN:1612-8850
Container-title:Plasma Processes and Polymers
language:en
Short-container-title:Plasma Processes & Polymers

Author:

Kim Jinhyuk¹,Choi Gilyoung¹,Kwon Kwang‐Ho¹^ORCID

Affiliation:

1. Department of Control and Instrumentation Engineering Korea University Sejong Republic of Korea

Funder

Korea Institute of Energy Technology Evaluation and Planning

Publisher

Wiley

Subject

Polymers and Plastics,Condensed Matter Physics

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/ppap.202200167

Reference36 articles.

1. Integration of scheduling and advanced process control in semiconductor manufacturing: review and outlook

2. Technological merits, process complexity, and cost analysis of self-aligned multiple patterning

3. Plasma etching: Yesterday, today, and tomorrow

4. Investigation of SiO2 Etch Characteristics by C6F6/Ar/O2 Plasmas Generated Using Inductively Coupled Plasma and Capacitively Coupled Plasma

5. Tailored ion energy distributions at an rf-biased plasma electrode

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Necking Reduction at Low Temperature in Aspect Ratio Etching of SiO2 at CF4/H2/Ar Plasma;Nanomaterials;2024-01-17

2. Etch Damage of SiOC Thin Films in an Inductively Coupled Plasma Using Low-Frequency;Applied Science and Convergence Technology;2024-01-10

3. Individual Effects of Various Plasma-Related Factors on the High Aspect Ratio Oxide Etching Process at Low-Frequency Bias Power Using an Inductively Coupled Plasma System;Plasma Chemistry and Plasma Processing;2023-08-08

4. Noble gas effect on ACL etching selectivity to SiO₂ films;Plasma Processes and Polymers;2023-06-08

5. Investigation of stochastic heating and its influence on plasma radial uniformity in biased inductively coupled Ar discharges by hybrid simulation;Physics of Plasmas;2023-04-01

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