Effect of AlN content on the performance of brominated epoxy resin for printed circuit board substrate
Author:
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Physical and Theoretical Chemistry,Condensed Matter Physics
Reference42 articles.
1. Thermally conductive EMC (epoxy molding compound) for microelectronic encapsulation
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3. Improved thermal conductivity in microelectronic encapsulants
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5. Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging
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