Effect of Electroplating Parameters on Internal Stress in Ni-MoS2Composite Plating-Reference-Cited by-同舟云学术

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Effect of Electroplating Parameters on Internal Stress in Ni-MoS2Composite Plating

Published:2013-02-25 Issue: Volume: Page:191-199
ISSN:
Container-title:TMS2013 Supplemental Proceedings
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Author:

Güler Ebru Saraloǧlu,Konca Erkan,Karakaya İshak

Publisher

John Wiley & Sons, Inc.

Reference28 articles.

1. Review of Electrocodeposition;Stojak;Advances in Electrochemical Science and Engineering,2001

2. Effect of surfactant BAS on MoS2 codeposition behaviour;Wang;Journal of Applied Electrochemistry,2008

3. Process aspects of the electrolytic codeposition of molybdenum disulfide with nickel;Chang;Electrochimica Acta,1998

4. The Influence of Process Parameters on the MoS2 Content of Ni-MoS2 Composite Coating by the Robust Design Method;Kuo;Journal of the Chinese Institute of Engineers,2004

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Formation of gold-plated electroformed copper structures;Advances in Materials and Processing Technologies;2015-10-02

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