Study on the Curing Process and the Gelation of Epoxy/Anhydride System for No-Flow Underfill for Flip-Chip Applications
Author:
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Organic Chemistry,General Chemical Engineering
Cited by 24 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
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4. Preparation of Chloride Salt of Octa (Aminopropylsilsesquioxane) Filled Low-κ Epoxy Composites with Improved Thermal Stability and Low Water Absorption;Polymer-Plastics Technology and Materials;2020-08-20
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