Surface‐Reengineering of BNNs@Hydrocarbon Polymer Composites for Ultra‐Low Dielectric Constant for High‐Frequency Applications

Author:

Zahidul Islam MD1ORCID,Deb Hridam2ORCID,Khalid Hasan MD3ORCID,Abdullaev Azim2ORCID,Peng Kun1,Shi Shuaida1,Dong Yubing1,Fu Yaqin1ORCID

Affiliation:

1. School of Materials Science and Engineering Zhejiang Sci-Tech University Hangzhou Zhejiang 310018 China

2. College of Textile Science and Engineering Zhejiang Sci-Tech University Hangzhou 310018 China

3. School of Mechanical Engineering Hangzhou Dianzi University Hangzhou Zhejiang 310018 China

Abstract

AbstractThis research investigates the synthesis and evaluation of cyclic olefin copolymer (COC) composites with surface‐engineered boron nitride nanosheets (BNNs) at various concentrations. The study focuses on the impact of Cetyltrimethylammonium bromide (CTAB) on BNNs′ surface functionalization to improve their dispersion within the COC matrix, including its dielectric behavior, dielectric breakdown strength, thermal management capabilities, hygroscopic properties, and mechanical robustness. The methodological approach adopted for the fabrication of COC/BNNs hybrid composites commenced with the synthesis of BNNs, surface functionalization of BNNs, in‐situ mixing and hot‐press. This step aimed to enhance compatibility and adhesion between BNNs and the COC matrix, facilitating more homogeneous nanofiller dispersion. The investigative scope of this study encompassed a rigorous evaluation of the resultant composites, with a particular emphasis on their dielectric properties. The dielectric constant (ϵ′) and loss tangent (δ) were measured at a frequency of 10 GHz, revealing an ultra‐low dielectric constant of 1.28, an exceptionally minimal loss tangent of 0.000146, a remarkable 327% (In‐plane) & 129% (axial) increase of thermal conductivity, significant improvement of dielectric breakdown strength up to 88.4 mV/mm, and low water absorptions observed. These results indicate the potential of COC/BNNs composites for high‐frequency electronic packaging applications requiring low dielectric constants.

Funder

National Natural Science Foundation of China

Publisher

Wiley

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