Epoxy nanocomposites with reduced coefficient of thermal expansion-Reference-Cited by-同舟云学术

Epoxy nanocomposites with reduced coefficient of thermal expansion

Published:2019-03-07 Issue:26 Volume:136 Page:47703
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J Appl Polym Sci

Author:

Hirata Tatsuya¹,Li Peng²,Lei Fan³,Hawkins Spencer⁴,Mullins Michael J.⁵^ORCID,Sue Hung‐Jue⁵

Affiliation:

1. Fab Materials Research & Development Department, Electronics & Functional Products DivisionAsahi Kasei Corporation, 1‐105 Kanda Jinbocho, Chiyoda‐ku Tokyo 101‐8101 Japan

2. Formosa Plastics, 201 Formosa Drive Point Comfort, Texas 77978

3. Department of Materials Science and EngineeringSouthern University of Science and Technology Shenzhen, Guangdong 518055 China

4. Universal Technology Center, 1270 North Fairfield Road Dayton, Ohio 45432

5. Polymer Technology Center, Department of Materials Science and EngineeringTexas A&M University, College Station Texas 77843

Funder

Texas A and M University

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/app.47703

Reference28 articles.

1. Effects of underfill materials on the reliability of low-K flip-chip packaging

2. Influence of die-shift-distance of overhang dies on residual thermal shear stress in 5-chip SiP after EMC curing

3. Photosensitive Materials with Novel Phenolic Resins

4. Fatigue life and resistance analysis of COG assemblies under hygrothermal aging

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