ChemInform Abstract: Thermal Stability of Cu/CoSi2 Contacted p+n Shallow Junction with and Without TiW Diffusion Barrier.
-
Published:2010-08-18
Issue:4
Volume:26
Page:no-no
-
ISSN:0931-7597
-
Container-title:ChemInform
-
language:en
-
Short-container-title:ChemInform
Author:
CHIOU J.-C.,CHEN M.-C.