Transient heat conduction in a medium with multiple circular cavities and inhomogeneities
Author:
Publisher
Wiley
Subject
Applied Mathematics,General Engineering,Numerical Analysis
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/nme.2671/fullpdf
Reference41 articles.
1. Transient heat conduction analysis of 3D solids with fiber inclusions using the boundary element method;Ma;International Journal for Numerical Methods in Engineering,2008
2. On multiple circular inclusions in plane thermoelasticity;Chao;International Journal of Solids and Structures,1997
3. A new finite element for treating plane thermomechanical heterogeneous solids;Meguid;International Journal for Numerical Methods in Engineering,1999
4. On the thermoelastic stresses of multiple interacting inhomogeneities;Zhu;International Journal of Solids and Structures,2000
5. Application of an alternating method to the thermoelastic problems with multiple circular holes in an infinite domain;Yang;Journal of Thermal Stresses,2004
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Experimental validation of a frequency domain BEM model to study 2D and 3D heat transfer by conduction;Engineering Analysis with Boundary Elements;2012-11
2. Coupling BEM/TBEM and MFS for the simulation of transient conduction heat transfer;International Journal for Numerical Methods in Engineering;2010-08-19
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