Thermal properties of Central Aare granite for temperatures up to 500°C: Irreversible changes due to thermal crack formation
Author:
Affiliation:
1. Institute of Process EngineeringETH Zurich Zurich Switzerland
2. IBM Research Zurich Rüschlikon Switzerland
3. Geological InstituteETH Zurich Zurich Switzerland
Funder
Bundesamt für Energie
Publisher
American Geophysical Union (AGU)
Subject
General Earth and Planetary Sciences,Geophysics
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/2016GL070990
Reference36 articles.
1. The FEBEX benchmark test: case definition and comparison of modelling approaches
2. Rock stress measurements in the Grimsel Underground Rock Laboratory and their geological interpretation
3. Cooling-dominated cracking in thermally stressed volcanic rocks
4. Thermal Conductivity of Rocks and Minerals
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