1. Reliability of MEMS packaging : vacuum maintenance and packaging induced stress;Choa S.‐H.;Microsyst. Technol.,2005
2. Further studies in the rare gases. 1. The permeability of various glasses to helium;Urry W.D.;J. Am. Ceram. Soc,1932
3. Esashi M.(1993).Complex micromechanical structures by low temperature bonding. 183rd Electrochemical Society Meeting Honolulu Hawaii 1233–1234.
4. Electrode “polarization” in alkali‐containing glasses;Carlson D.E.;J. Am. Ceram. Soc.,1972