Characterization of Zn-Mo and Zn-Cr Pb-Free Composite Solders as a Potential Replacement for Pb-Containing Solders-Reference-Cited by-同舟云学术

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Characterization of Zn-Mo and Zn-Cr Pb-Free Composite Solders as a Potential Replacement for Pb-Containing Solders

Published:2019-03-29 Issue: Volume: Page:147-166
ISSN:
Container-title:Harsh Environment Electronics
language:
Short-container-title:

Author:

Islam Khairul¹,Sharif Ahmed²

Affiliation:

1. Bangladesh Council of Scientific and Industrial Research, IMMM; Science Laboratory Road Joypurhat 5900 Bangladesh

2. Bangladesh University of Engineering and Technology (BUET); Department of Materials and Metallurgical Engineering; Dhaka 1000 Bangladesh

Publisher

Wiley-VCH Verlag GmbH & Co. KGaA

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/9783527813964.ch7/fullpdf

Reference43 articles.

1. Carlin , C.M. Ray , J.K. 1994 The requirements for high-temperature electronics in a future high speed civil transport (HSCT) Proceedings 2nd International High Temperature Electronics Conference

2. A 500-dpi AC capacitive hybrid flip-chip CMOS ASIC/sensor module for fingerprint, navigation, and pointer detection with on-chip data processing;Vermesan;IEEE Journal of Solid-State Circuits,2003

3. Transient liquid phase Ag-based solder technology for high-temperature packaging applications;Sharif;Journal of Alloys and Compounds,2014

4. Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging;Islam;Journal of Electronic Materials,2005

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