Mechatronic Spatial Atomic Layer Deposition for Closed‐Loop and Customizable Process Control

Author:

Penley Daniel1,Cho Tae H.1,Brooks Andre J.1,Ransohoff Lauren1,Park Hyunwoo1,Herman Ellis1,Zhao Enpei1,Trejo Orlando1,Barton Kira12,Dasgupta Neil P.13ORCID

Affiliation:

1. Department of Mechanical Engineering University of Michigan Ann Arbor MI 48109 USA

2. Department of Robotics University of Michigan Ann Arbor MI 48109 USA

3. Department of Materials Science and Engineering University of Michigan Ann Arbor MI 48109 USA

Abstract

AbstractA customized atmospheric‐pressure spatial atomic layer deposition (AP‐SALD) system is designed and implemented, which enables mechatronic control of key process parameters, including gap size and parallel alignment. A showerhead depositor delivers precursors to the substrate while linear actuators and capacitance probe sensors actively maintain gap size and parallel alignment through multiple‐axis tilt and closed‐loop feedback control. Digital control of geometric process variables with active monitoring is facilitated with a custom software control package and user interface. AP‐SALD of TiO2 is performed to validate self‐limiting deposition with the system. A novel multi‐axis printing methodology is introduced using xy position control to define a customized motion path, which enables an improvement in the thickness uniformity by reducing variations from 8% to 2%. In the future, this mechatronic system will enable experimental tuning of parameters that can inform multi‐physics modeling to gain a deeper understanding of AP‐SALD process tolerances, enabling new pathways for non‐traditional SALD processing that can push the technology towards large‐scale manufacturing.

Funder

National Science Foundation

Division of Civil, Mechanical and Manufacturing Innovation

Publisher

Wiley

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