Biocompatible Collagen Films as Substrates for Flexible Implantable Electronics-Reference-Cited by-同舟云学术

Biocompatible Collagen Films as Substrates for Flexible Implantable Electronics

Published:2015-07-02 Issue:9 Volume:1 Page:1500154
ISSN:2199-160X
Container-title:Advanced Electronic Materials
language:en
Short-container-title:Adv. Electron. Mater.

Author:

Moreno Salvador¹,Baniasadi Mahmoud¹,Mohammed Shakil²,Mejia Israel²,Chen Yuanning³,Quevedo-Lopez Manuel Angel²,Kumar Nalin⁴,Dimitrijevich Slobodan⁴,Minary-Jolandan Majid¹⁵

Affiliation:

1. Department of Mechanical Engineering; University of Texas at Dallas; 800 W., Campbell Road Richardson TX 75080 USA

2. Department of Materials Science and Engineering; University of Texas at Dallas; 800 W., Campbell Road Richardson TX 75080 USA

3. Microsol Technologies Inc; Plano TX 75093 USA

4. UHV Technologies Inc; 450 South Freeway Fort Worth TX 76104 USA

5. UT Dallas NanoTech Institute; University of Texas at Dallas; 800 W., Campbell Road Richardson TX 75080 USA

Publisher

Wiley

Subject

Electronic, Optical and Magnetic Materials

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/aelm.201500154/fullpdf

Reference41 articles.

1. Dissolvable films of silk fibroin for ultrathin conformal bio-integrated electronics

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3. Silk-based resorbable electronic devices for remotely controlled therapy and in vivo infection abatement

4. Electronic dura mater for long-term multimodal neural interfaces

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