Unraveling the Solution Aggregation Structures and Processing Resiliency of High‐Efficiency Organic Photovoltaic Blends

Author:

Gao Mengyuan1,Sun Chunlong1,Li Yiwen2,Li Na2,Jiang Hanqiu34,He Chunyong34,Chen Yu3,Zhao Wenchao5,Hou Jianhui6,Ye Long1ORCID

Affiliation:

1. School of Materials Science & Engineering Tianjin Key Laboratory of Molecular Optoelectronic Sciences Key Laboratory of Organic Integrated Circuits Ministry of Education Collaborative Innovation Center of Chemical Science and Engineering (Tianjin) Tianjin University Tianjin 300350 China

2. National Facility for Protein Science Shanghai Shanghai Advanced Research Institute Chinese Academy of Sciences Shanghai 201210 China

3. Institute of High Energy Physics Chinese Academy of Sciences Beijing 100049 China

4. Spallation Neutron Source Science Center Dongguan 523803 China

5. Co‐Innovation Center of Efficient Processing and Utilization of Forest Resources, College of Materials Science and Engineering Nanjing Forestry University Nanjing 210037 China

6. State Key Laboratory of Polymer Physics and Chemistry, Beijing National Laboratory for Molecular Sciences, Institute of Chemistry Chinese Academy of Sciences Beijing 100190 China

Abstract

AbstractThe solution aggregation structure of conjugated polymers is crucial to the morphology and resultant optoelectronic properties of organic electronics and is of considerable interest in the field. Precise characterizations of the solution aggregation structures of organic photovoltaic (OPV) blends and their temperature‐dependent variations remain challenging. In this work, the temperature‐dependent solution aggregation structures of three representative high‐efficiency OPV blends using small‐angle X‐ray/neutron scattering are systematically probed. Three cases of solution processing resiliency are elucidated in state‐of‐the‐art OPV blends. The exceptional processing resiliency of high‐efficiency PBQx‐TF blends can be attributed to the minimal changes in the multiscale solution aggregation structure at elevated temperatures. Importantly, a new parameter, the percentage of acceptors distributed within polymer aggregates (Ф), for the first time in OPV blend solution, establishes a direct correlation between Ф and performance is quantified. The device performance is well correlated with the Kuhn length of the cylinder related to polymer aggregates L1 at the small scale and the Ф at the large scale. Optimal device performance is achieved with L1 at ≈30 nm and Ф within the range of 60 ± 5%. This study represents a significant advancement in the aggregation structure research of organic electronics.

Funder

National Natural Science Foundation of China

Science Fund for Distinguished Young Scholars of Tianjin Municipality

Fundamental Research Funds for the Central Universities

Publisher

Wiley

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