Selective preparation of oligomeric naphthylene ether and its applications to epoxy resin for silicon carbide power semiconductor device materials-Reference-Cited by-同舟云学术

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Selective preparation of oligomeric naphthylene ether and its applications to epoxy resin for silicon carbide power semiconductor device materials

Published:2016-01-13 Issue:17 Volume:133 Page:n/a-n/a
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J. Appl. Polym. Sci.

Author:

Arita Kazuo¹²,Oyama Toshiyuki²

Affiliation:

1. Corporate R&D Department; DIC Corporation; 632 Sakado Sakura Chiba 290-8668 Japan

2. Department of Advanced Materials Chemistry; Yokohama National University; 79-5 Tokiwadai Hodogaya-Ku Yokohama 240-8501 Japan

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/app.43339/fullpdf

Reference22 articles.

1. Packaging Technology for High Temperature Operation of Power Semiconductor Modules

2. Ishii , T. 2006

3. Epoxy thermosetting systems: Dynamic mechanical analysis of the reactions of aromatic diamines with the diglycidyl ether of bisphenol A

4. Synthesis of high purity o-cresol formaldehyde novolac epoxy resins

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2. Review on the Synthesis, Recyclability, Degradability, Self-Healability and Potential Applications of Reversible Imine Bond Containing Biobased Epoxy Thermosets;Reactions;2023-12-01

3. Synthesis, characterization, and properties of a novel propargyl ether naphthalene phenolic resin;Polymers for Advanced Technologies;2023-10-31

4. High performance epoxy resin with ultralow coefficient of thermal expansion cured by conformation-switchable multi-functional agent;Chemical Engineering Journal;2022-12

5. Development of Tg-less epoxy thermosets by introducing crosslinking points into rigid mesogenic moiety via Schiff base-derived self-polymerization;Materials Today Communications;2022-06

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