Author:
Zhang Yi-He,Dang Zhi-Min,Xin John H.,Daoud Walid A.,Ji Jun-Hui,Liu Yuyang,Fei Bin,Li Yuanqing,Wu Juntao,Yang Shiyong,Li Lai-Feng
Subject
Materials Chemistry,Polymers and Plastics,Organic Chemistry
Reference27 articles.
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2. , “Microelectronics Packaging Handbook”, Van Nostrand Reinhold, New York 1989, p. 25.
3. Dielectric behavior and dependence of percolation threshold on the conductivity of fillers in polymer-semiconductor composites
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