Photopolymerizable liquid encapsulants for microelectronic devices: Thermal and mechanical properties of systems with reduced in-mold cure times-Reference-Cited by-同舟云学术

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Photopolymerizable liquid encapsulants for microelectronic devices: Thermal and mechanical properties of systems with reduced in-mold cure times

Published:2001 Issue:14 Volume:81 Page:3449-3461
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J. Appl. Polym. Sci.

Author:

Baikerikar Kiran K.,Scranton Alec B.

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Reference25 articles.

1. ; Electronic Materials Handbook; Ed.; ASM International: Materials Park, OH, 1989, p. 802.

2. Plastic Packaging of Microelectronic Devices; Van Nostrand Reinhold: New York, 1990.

3. Photopolymerizable liquid encapsulants for microelectronic devices

4. ; ; RadTech '98 North America UV/EB Conference Proceedings, 1998, p. 31.

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