Humidity Threshold Model of Numerical Control Multilayer Printed Circuit Board for Electrochemical Migration-Reference-Cited by-同舟云学术

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Humidity Threshold Model of Numerical Control Multilayer Printed Circuit Board for Electrochemical Migration

Published:2014-03-12 Issue:4 Volume:31 Page:567-578
ISSN:0748-8017
Container-title:Quality and Reliability Engineering International
language:en
Short-container-title:Qual. Reliab. Engng. Int.

Author:

Xie Chuanning¹,Tang Xiaoqi¹,Chen Jihong¹,Song Bao¹,Jin Jian¹,Zhang Hangjun¹

Affiliation:

1. School of Mechanical Science and Technology; Huazhong University of Science and Technology; Wuhan 430074 China

Funder

National Natural Science Foundation of China

National Science and Technology Major Project

Publisher

Wiley

Subject

Management Science and Operations Research,Safety, Risk, Reliability and Quality

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/qre.1612/fullpdf

Reference29 articles.

1. Electrochemical migration of tin in electronics and microstructure of the dendrites;Minzari;Corrosion Science,2011

2. Electrochemical migration: electrically induced failures in printed wiring assemblies 1997

3. Siah LF Moisture-driven electromigrative degradation in microelectronic packages 2010 503 522

4. Towards a more systematic analysis of uncertain user-product interactions in product development: an enhanced user-product interaction framework;Lu;Quality and Reliability Engineering International,2007

5. Electrochemical migration characteristics of eutectic SnPb solder alloy in printed circuit board;Park;Thin Solid Films,2006

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Combined Effects of Polluted Particles and Environmental Factors on Electrochemical Migration Failure;IEEE Transactions on Device and Materials Reliability;2023-03

2. Electrochemical migration of Sn and Sn solder alloys: a review;RSC Advances;2017

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