Elastomeric Thermal Interface Materials with High Through-Plane Thermal Conductivity from Carbon Fiber Fillers Vertically Aligned by Electrostatic Flocking-Reference-Cited by-同舟云学术

Elastomeric Thermal Interface Materials with High Through-Plane Thermal Conductivity from Carbon Fiber Fillers Vertically Aligned by Electrostatic Flocking

Published:2014-07-08 Issue:33 Volume:26 Page:5857-5862
ISSN:0935-9648
Container-title:Advanced Materials
language:en
Short-container-title:Adv. Mater.

Author:

Uetani Kojiro¹,Ata Seisuke²¹,Tomonoh Shigeki²,Yamada Takeo²¹,Yumura Motoo²¹,Hata Kenji²¹

Affiliation:

1. Technology Research Association for Single Wall Carbon Nanotubes (TASC); 1-1-1 Higashi Tsukuba Ibaraki 305-8565 Japan

2. Nanotube Research Center; National Institute of Advanced Industrial Science and Technology (AIST); 1-1-1 Higashi Tsukuba Ibaraki 305-8565 Japan

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/adma.201401736/fullpdf

Reference25 articles.

1. Thermal Interface Materials - A Review of the State of the Art

2. Thermal properties of graphene and nanostructured carbon materials

3. Dimensional crossover of thermal transport in few-layer graphene

4. Graphite Nanoplatelet−Epoxy Composite Thermal Interface Materials

5. Graphene–Multilayer Graphene Nanocomposites as Highly Efficient Thermal Interface Materials

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