The TiC/Ni-Cr Composites with Low Thermal Expansion and Electrical Resistivity Applied for IT-SOFC Interconnects-Reference-Cited by-同舟云学术

The TiC/Ni-Cr Composites with Low Thermal Expansion and Electrical Resistivity Applied for IT-SOFC Interconnects

Published:2016-05-25 Issue:8 Volume:18 Page:1504-1510
ISSN:1438-1656
Container-title:Advanced Engineering Materials
language:en
Short-container-title:Adv. Eng. Mater.

Author:

Qi Qian¹²,Liu Yan¹,Zhang Hui¹,Zhao Jing¹,Gai Linlin¹²,Huang Zhengren¹

Affiliation:

1. State Key Laboratory of High Performance Ceramics and Superfine Microstructures; Shanghai Institute of Ceramics; Chinese Academy of Sciences; Shanghai 200050 China

2. Graduate University of the Chinese Academy of Sciences; Beijing 100049 China

Publisher

Wiley

Subject

Condensed Matter Physics,General Materials Science

Reference27 articles.

1. Selection and Evaluation of Heat-Resistant Alloys for SOFC Interconnect Applications

2. Evaluation of Ni–Cr-base alloys for SOFC interconnect applications

3. The Kinetics of Metadynamic Recrystallization in a Ni-Cr-Mo-Based Superalloy Hastelloy C-276

4. Development of interconnect materials for solid oxide fuel cells

5. Synthesis of TiC/Mg composites with interpenetrating networks by in situ reactive infiltration process

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