Advancements in the identification of passiveRCnetworks for compact modeling of thermal effects in electronic devices and systems-Reference-Cited by-同舟云学术

Advancements in the identification of passiveRCnetworks for compact modeling of thermal effects in electronic devices and systems

Published:2017-09-15 Issue:3 Volume:31 Page:e2296
ISSN:0894-3370
Container-title:International Journal of Numerical Modelling: Electronic Networks, Devices and Fields
language:en
Short-container-title:Int J Numer Model

Author:

De Tommasi L.¹,Magnani A.²,de Magistris M.²^ORCID

Affiliation:

1. United Technologies Research Center, Penrose Business Centre; Penrose Wharf Cork Ireland

2. Dept. of Electrical Engineering and Information Technology, University FEDERICO II; Naples Italy

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Computer Science Applications,Modeling and Simulation

Reference46 articles.

2. Thermally aware design;Zhan;Found Trends Elec Design Auto,2008

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

2. Thermal modeling of the cylindrical electromagnets in transient and steady-state modes;COMPEL - The international journal for computation and mathematics in electrical and electronic engineering;2023-04-25

3. Numerical study of heat transfer in high voltage solid insulating materials using transmission line method;COMPEL - The international journal for computation and mathematics in electrical and electronic engineering;2022-06-17