Ultrathin, High Capacitance Capping Layers for Silicon Electronics with Conductive Interconnects in Flexible, Long‐Lived Bioimplants-Reference-Cited by-同舟云学术

Ultrathin, High Capacitance Capping Layers for Silicon Electronics with Conductive Interconnects in Flexible, Long‐Lived Bioimplants

Published:2019-11-29 Issue:1 Volume:5 Page:1900800
ISSN:2365-709X
Container-title:Advanced Materials Technologies
language:en
Short-container-title:Adv. Mater. Technol.

Author:

Li Jinghua¹²³,Li Rui⁴,Chiang Chia‐Han⁵,Zhong Yishan²,Shen Haixu¹,Song Enming²⁶,Hill Mackenna⁵,Won Sang Min²⁶,Yu Ki Jun⁷,Baek Janice Mihyun⁸,Lee Yujin⁸,Viventi Jonathan⁵,Huang Yonggang⁹,Rogers John A.¹²¹⁰^ORCID

Affiliation:

1. Department of Materials Science and EngineeringNorthwestern University Evanston IL 60208 USA

2. Department of Materials Science and EngineeringFrederick Seitz Materials Research LaboratoryUniversity of Illinois at Urbana‐Champaign Urbana IL 61801 USA

3. Department of Materials Science and EngineeringCenter for Chronic Brain InjuryThe Ohio State University Columbus OH 43210 USA

4. State Key Laboratory of Structural Analysis for Industrial EquipmentDepartment of Engineering MechanicsInternational Research Center for Computational MechanicsDalian University of Technology Dalian 116024 P. R. China

5. Department of Biomedical EngineeringDuke University Durham NC 27708 USA

6. Center for Bio‐Integrated ElectronicsNorthwestern University Evanston IL 60208 USA

7. School of Electrical and Electronic EngineeringYonsei University Seoul 03722 Republic of Korea

8. Department of ChemistryUniversity of Illinois at Urbana‐Champaign Urbana IL 61801 USA

9. Department of Civil and Environmental EngineeringMechanical EngineeringMaterials Science and EngineeringCenter of Bio‐Integrated electronicsNorthwestern University Evanston IL 60208 USA

10. Center for Bio‐Integrated ElectronicsSimpson Querrey Institute for BioNanotechnologyDepartment of Materials Science and EngineeringBiomedical EngineeringChemistryMechanical EngineeringElectrical Engineering and Computer Science, and Neurological SurgeryMcCormick School of Engineering and Feinberg School of Medicine Northwestern University Evanston IL 60208 USA

Funder

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

National Institutes of Health

National Research Foundation of Korea

Publisher

Wiley

Subject

Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/admt.201900800

Reference51 articles.