Multiscale and Uniform Liquid Metal Thin‐Film Patterning Based on Soft Lithography for 3D Heterogeneous Integrated Soft Microsystems: Additive Stamping and Subtractive Reverse Stamping-Reference-Cited by-同舟云学术

Multiscale and Uniform Liquid Metal Thin‐Film Patterning Based on Soft Lithography for 3D Heterogeneous Integrated Soft Microsystems: Additive Stamping and Subtractive Reverse Stamping

Published:2018-05-17 Issue:7 Volume:3 Page:1800061
ISSN:2365-709X
Container-title:Advanced Materials Technologies
language:en
Short-container-title:Adv. Mater. Technol.

Author:

Kim Min‐gu¹²^ORCID,Kim Choongsoon¹²,Alrowais Hommood¹²,Brand Oliver¹²

Affiliation:

1. School of Electrical and Computer Engineering Georgia Institute of Technology Atlanta GA 30332 USA

2. Institute for Electronics and Nanotechnology Georgia Institute of Technology Atlanta GA 30332 USA

Funder

National Science Foundation

Publisher

Wiley

Subject

Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/admt.201800061

Reference59 articles.

1. Functional Materials: From Hard to Soft Porous Frameworks

2. Soft Matter Nanotechnology

3. Printing soft matter in three dimensions

4. Three-dimensional printing with sacrificial materials for soft matter manufacturing

5. CMOS-Technology-Enabled Flexible and Stretchable Electronics for Internet of Everything Applications

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